US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Apparatus and methods for chemical mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,915, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus and methods for chemical mechanical polishing" was invented by Te-Chien Hou (Hsinchu, Taiwan), Chen-Chi Tang (Hsinchu, Taiwan), Chi-hsiang Shen (Hsinchu, Taiwan), Jeng-Chi Lin (Hsinchu, Taiwan), Chen-Hao Wu (Hsinchu, Taiwan) and Shich-Chang Suen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate to a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure relate to an in-situ defect data analyzer to identify CMP induced defects...