US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,823, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Semiconductor structure" was invented by Chia-Ming Pan (Tainan City, Taiwan), Chia-Ta Hsieh (Tainan City, Taiwan), Po-Wei Liu (Tainan City, Taiwan) and Yun-Chi Wu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor substrate, first to third isolation structures, and a conductive feature. The first to third isolation structures are over the semiconductor substrate and spaced apart from each other. The semiconductor substrate comprises a region surrounded by a sidewall of the first iso...