US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Packaged semiconductor device including liquid-cooled lid and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,028, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packaged semiconductor device including liquid-cooled lid and methods of forming the same" was invented by Sheng-Tsung Hsiao (Taoyuan City, Taiwan), Jen Yu Wang (Hsinchu, Taiwan), Chung-Jung Wu (Hsinchu, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan) and Chih-Hang Tung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first in...