US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "Method for forming semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,649,652, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for forming semiconductor structure" was invented by Ching-Kai Shen (Hsinchu County, Taiwan), Jung-Kuo Tu (Hsinchu City, Taiwan), Wei-Cheng Shen (Tainan City, Taiwan) and Yi-Chuan Teng (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure includes following operations. An interconnect structure is formed over a substrate. The interconnect structure includes a top conductive layer. A dielectric structure is formed over the interconnect structure. The dielectric structure is pa...