US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Dummy dies for reducing warpage in packages" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,031, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dummy dies for reducing warpage in packages" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes placing a plurality of functional dies over a carrier, placing a plurality of dummy dies over the carrier, encapsulating the plurality of functional dies and the plurality of dummy dies in an encapsulant, and forming redistribution lines over and interconnecting the plurality of functional dies. The r...