US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Photonic package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,648, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photonic package and method for forming the same" was invented by Wei-Ming Wang (Taichung City, Taiwan), Chen Chen (New Taipei City, Taiwan), Chih-Hao Yu (Tainan City, Taiwan) and Shih-Peng Tai (Xinpu Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package is provided. The method includes forming a first wafer that includes multiple photonic dies. The method includes forming a second wafer that includes multiple electronic dies. The method includes forming micro lenses within ...