US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Heterogeneous antenna in fan-out package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,168, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Heterogeneous antenna in fan-out package" was invented by Po-Yao Chuang (Hsinchu, Taiwan), Po-Hao Tsai (Taoyuan, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution str...