US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Backside contact structures for semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,335, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Backside contact structures for semiconductor devices" was invented by Chia-Hung Chu (Taipei City, Taiwan), Tsungyu Hung (Hsinchu City, Taiwan), Hsu-Kai Chang (Hsinchu, Taiwan), Ding-Kang Shih (New Taipei City, Taiwan), Keng-Chu Lin (Chao-Chou, Taiwan), Pang-Yen Tsai (Jhu-bei City, Taiwan), Sung-Li Wang (Zhubei City, Taiwan) and Shuen-Shin Liang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a method to form a semiconductor device with backside contact structures. The method includes forming...