US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 3 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,742, issued on June 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Hsiang-Tai Lu (Hsinchu County, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan), Mill-Jer Wang (Hsinchu, Taiwan), Feng-Cheng Hsu (New Taipei, Taiwan), Chao-Hsiang Yang (Hsinchu, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Cheng-Yi Hong (Hsinchu, Taiwan), Chih-Hsien Lin (Tai-Chung, Taiwan), Dai-Jang Chen (New Taipei, Taiwan) and Chen-Hua Lin (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure, comprising a redistribution layer (RDL) incl...