US Patent Issued to Taiwan Semiconductor Manufacturing on June 3 for "Method of forming an integrated circuit package having a padding layer on a carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,726, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming an integrated circuit package having a padding layer on a carrier" was invented by Cheng-Hsien Hsieh (Kaohsiung, Taiwan), Li-Han Hsu (Hsin-Chu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan), Der-Chyang Yeh (Hsin-Chu, Taiwan) and Wei-Chih Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an integrated circuit package includes following operations. A padding layer is formed on a portion of a carrier. A first semiconductor die is placed on the padding layer and a second semiconductor die is placed on th...