US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "System and method for thermal management of reticle in semiconductor manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,732, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System and method for thermal management of reticle in semiconductor manufacturing" was invented by Yueh-Lin Yang (Tainan City, Taiwan) and Chi-Hung Liao (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor processing method includes: selecting a target state of a reticle based on a given data set, wherein the given data set comprises temperature profiles of the reticle correlated to a target overlay performance, and the target state is a state in which a deformation of the reticle is substantially unchanged; reg...