US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor device including self-aligned via and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,947, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including self-aligned via and method of manufacturing the same" was invented by Hwei-Jay Chu (Hsinchu City, Taiwan), Hsi-Wen Tien (Hsinchu County, Taiwan), Wei-Hao Liao (Taichung City, Taiwan), Yu-Teng Dai (New Taipei City, Taiwan), Hsin-Chieh Yao (Hsinchu City, Taiwan), Cheng-Hao Chen (Kaohsiung City, Taiwan) and Chih Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate, a first c...