US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Semiconductor device and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,641, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of fabricating the same" was invented by Cheng-You Tai (Taipei City, Taiwan), Ling-Sung Wang (Hsinchu, Taiwan), Chen-Chieh Chiang (Kaohsiung City, Taiwan), Jung-Chi Jeng (Tainan City, Taiwan), Po-Yuan Su (Kaohsiung City, Taiwan) and Tsung Jing Wu (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having fins and trenches in between the fins, a plurality of insulators, a first metal layer, an insulating layer, a second metal layer and an interlayer dielec...