ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,968, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and method forming same" was invented by Wen-Yi Lin (New Taipei City, Taiwan), Kuang-Chun Lee (New Taipei City, Taiwan), Chien-Chen Li (Hsinchu, Taiwan), Chien-Li Kuo (Hsinchu, Taiwan) and Kuo-Chio Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a large package component, such as a CoWoS, adhered to a large package substrate, such as a printed circuit board, an under...