ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,709, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and method" was invented by Chih-Yun Chin (Taichung, Taiwan), Yen-Ru Lee (Hsinchu, Taiwan), Chien-Chang Su (Kaohsiung, Taiwan), Yan-Ting Lin (Baoshan Township, Taiwan), Chien-Wei Lee (Kaohsiung, Taiwan), Bang-Ting Yan (Hsinchu, Taiwan), Heng-Wen Ting (Pingtung, Taiwan), Chii-Horng Li (Zhubei, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming first devices in a first region of a substrate, wherein each first device has a first number of fins; forming second device...