US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,595, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by I-Che Lee (Hsinchu, Taiwan), Huai-Ying Huang (New Taipei City, Taiwan), Yen-Chieh Huang (Hsinchu, Taiwan), Wei-Gang Chiu (New Taipei City, Taiwan), Kai-Wen Cheng (Taichung City, Taiwan), Yu-Ming Lin (Hsinchu City, Taiwan) and Chung-Te Lin (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an interconnect, a memory cell, and a plurality of first barrier structures. The interconnect is disposed over the substrate. The ...