US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Method of manufacturing a semiconductor device having a dumbbell-shaped contact connecting differently recessed source/drain epitaxial layers" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,693, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device having a dumbbell-shaped contact connecting differently recessed source/drain epitaxial layers" was invented by Te-Chih Hsiung (Taipei City, Taiwan), Yun-Hua Chen (Zhubei City, Taiwan), Yang-Cheng Wu (Hsinchu City, Taiwan), Sheng-Hsun Fu (Hsinchu County, Taiwan), Wen-Kuo Hsieh (Taipei City, Taiwan), Chih-Yuan Ting (Taipei City, Taiwan), Huan-Just Lin (Hsinchu City, Taiwan), Bing-Sian Wu (Hsinchu City, Taiwan) and Yi-Hsuan Chiu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In...