ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,921, issued on June 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Test circuit and method for operating the same" was invented by Chia-Wei Huang (Hsinchu City, Taiwan), Wei-Jhih Wang (Hsinchu, Taiwan), Cheng-Cheng Kuo (Hsinchu, Taiwan) and Yuan-Yao Chang (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wafer. The wafer includes a die, a scribe line adjacent to the die, and a test circuit adjacent to the scribe line. The test circuit includes a first switch configured to simultaneously couple a first DUT of a first set of DUTs arranged in a first column an...