US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Surface treatment in integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,498, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Surface treatment in integrated circuit package and method" was invented by Chen-Shien Chen (Zhubei, Taiwan), Chi-Yen Lin (Tainan, Taiwan), Po-Chen Chen (Hsinchu, Taiwan), Wu-An Weng (Hsinchu, Taiwan) and Hsu-Hsien Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first integrated circuit die and a second integrated circuit die over and bonded to the first integrated circuit die. A first surface region of the second integrated circuit die is hydrophobic, and the first integrated circuit die and the second inte...