US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor structure with dielectric wall structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,264, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor structure with dielectric wall structure and method for manufacturing the same" was invented by Yu-Lung Tung (Kaohsiung City, Taiwan), Xiaodong Wang (Hsinchu City, Taiwan) and Jhon-Jhy Liaw (Zhudong Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a first well region and longitudinally oriented along a first direction and a second well region adjoining the first well region in a second dir...