US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Package with improved heat dissipation efficiency and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,620, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package with improved heat dissipation efficiency and method for forming the same" was invented by Hung-Yi Kuo (Taipei City, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Kuo-Chung Yee (Taoyuan City, Taiwan), Yu-Jen Lien (Tainan City, Taiwan), Ke-Han Shen (Chiayi City, Taiwan), Wei-Kong Sheng (Chu-Nan, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Tsung-Fu Tsai (Changhua City, Taiwan), Chung-Ju Lee (Hsinchu, Taiwan) and Chih-Ming Ke (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package incl...