US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,616, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly" was invented by Ping-Yin Hsieh (Hsinchu city, Taiwan), Li-Hui Cheng (New Taipei City, Taiwan), Pu Wang (Hsinchu City, Taiwan) and Ying-Ching Shih (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a substrate, such as a printed circuit board (PCB) substrate. A chip assembly is disposed over the substrate. The chip assembly includes an IC, a plurality of electronic memory devices coupled...