ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,515, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"In situ and tunable deposition of a film" was invented by Chia-Hsi Wang (Changhua County, Taiwan), Yen-Yu Chen (Taichung City, Taiwan) and Jen-Hao Chien (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method is provided. The method includes the following steps: introducing a first physical vapor deposition (PVD) target and a second PVD target in a PVD system, the first PVD target containing a boron-containing cobalt iron alloy (FeCoB) with an initial boron concentration, and the second PVD target containing boron; determining pa...