US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Semiconductor stitch structure and method for forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,935, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor stitch structure and method for forming the same" was invented by You-Cheng Lu (Tainan City, Taiwan), Stefan Rusu (Sunnyvale, Calif.), Lan-Chou Cho (Hsinchu City, Taiwan) and Ming Yang Jung (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a plurality of semiconductor dies, a first stitch structure disposed in the plurality of semiconductor dies, and a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies. The semic...