US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Semiconductor device manufacturing method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,675,008, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device manufacturing method" was invented by Yu-Hao Chen (Hsinchu, Taiwan), Hui Yu Lee (Hsinchu, Taiwan), Jui-Feng Kuan (Hsinchu, Taiwan) and Chien-Te Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. The optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. The second side pat...