US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Method and system for manufacturing a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,675,629, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and system for manufacturing a semiconductor device" was invented by Hsuan-Ming Huang (Hsinchu, Taiwan), An Shun Teng (Hsinchu, Taiwan), Mingni Chang (Hsinchu City, Taiwan), Ming-Yih Wang (Hsin-Chu, Taiwan) and Yinlung Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for manufacturing a semiconductor structure. The method includes receiving layout data representing information for manufacturing the semiconductor structure. A first parasitic capacitance is formed in a first region ...