ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,790, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Kuan-Yu Huang (Taipei, Taiwan), Sung-Hui Huang (Yilan County, Taiwan) and Shang-Yun Hou (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an encapsulated semiconductor device, and a plurality of conductive bumps. The package substrate includes a device mounting region, a plurality of substrate pads and a solder resist layer. The encapsulated semiconductor device is disposed over the device mounting region and includes a plurality of device pa...