US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Photonic package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,693,471, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photonic package and method for forming the same" was invented by Kuo-Hao Lee (Hsinchu, Taiwan), Xin-Hua Huang (Changhua County, Taiwan), Jung-Kuo Tu (Hsinchu City, Taiwan), Kejun Xia (Hsinchu City, Taiwan) and Tse-En Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic package includes an optical die and an electronic die. The optical die has a first side and a second side opposite to the first side. The optical die includes a first grating coupler, a second grating coupler separated from the first grating cou...