US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,810, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure and method for forming the same" was invented by Chia-Chia Lin (Kaohsiung City, Taiwan), Chih-Hsin Lu (Tainan City, Taiwan), Chung-Hao Tsai (Changhua County, Taiwan), Hsing-Kuo Hsia (Hsinchu County, Taiwan), Chuei-Tang Wang (Taichung City, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided, and includes an interposer, a control unit, a plurality of computing units, a signal transmission layer, and an electric-optical material. The control unit is bonded...