US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Cover ring and ground shield for physical vapor deposition chamber" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,596, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Cover ring and ground shield for physical vapor deposition chamber" was invented by Tsung-Cheng Wu (Hsinchu, Taiwan), Sheng-Ying Wu (Hsinchu, Taiwan) and Ming-Hsien Lin (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly includes a cover ring having a first surface and a second surface opposite the first surface, the first surface of the cover ring having a first roughness, and a deposition ring having a first surface facing the cover ring and a second surface opposite the first surface, the first surface of the d...