US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Bond pad structure for bonding improvement" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,556, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bond pad structure for bonding improvement" was invented by Sin-Yao Huang (Tainan City, Taiwan), Ching-Chun Wang (Tainan, Taiwan), Dun-Nian Yaung (Taipei City, Taiwan), Feng-Chi Hung (Chu-Bei City, Taiwan), Ming-Tsong Wang (Taipei City, Taiwan) and Shih Pei Chou (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate an integrated circuit (IC) including a first substrate. An interconnect structure is disposed over the first substrate. The interconnect structure includes a plurality of metal features that are sta...