US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Workpiece support" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,791, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Workpiece support" was invented by Ming-Yi Shen (Hsinchu, Taiwan), Yao Fong Dai (Hsinchu, Taiwan), Yin-Tun Chou (Hsinchu, Taiwan), Yuan-Hsin Chi (Hsinchu, Taiwan) and Sheng-Yuan Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to workpiece support for supporting a workpiece during semiconductor processing. The workpiece support includes one or more support frame bodies including a plurality of spaced apart spacers on a first surface of the support frame bodies. The spacers include a first surfa...