US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Integrated circuit package with improved heat dissipation efficiency and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,492, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package with improved heat dissipation efficiency and methods of forming the same" was invented by Kuo-Chiang Ting (Hsinchu, Taiwan), Sung-Feng Yeh (Taipei City, Taiwan) and Ta Hao Sung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes a first integrated circuit die, wherein the first integrated circuit die includes a substrate formed of a semiconductor material and a conductive via penetrating through the substrate; a second integrated circuit die disposed laterally adjacent to ...