ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,862, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Semiconductor structure and method for forming the same" was invented by Kuan-Ting Pan (Taipei City, Taiwan), Jia-Chuan You (Taoyuan City, Taiwan), Chia-Hao Chang (Hsinchu City, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first dielectric wall over a substrate, and two metal gate structures disposed at two sides of the first dielectric wall. Each of the metal gate structures includes a plurality of nanosheets sta...