US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Semiconductor device packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,236, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device packages and methods of forming the same" was invented by Chi-Yang Yu (Zhongli City, Taiwan), Chin-Liang Chen (Kaohsiung City, Taiwan), Hao-Cheng Hou (Hsinchu, Taiwan), Jung Wei Cheng (Hsinchu, Taiwan), Yu-Min Liang (Zhongli City, Taiwan) and Tsung-Ding Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device packages and methods of forming the same are discussed. In an embodiment, a device includes: a redistribution structure comprising an upper dielectric layer and an under-bump metallization;...