US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Robot blade for wafers and workpieces and thin wafers and workpieces" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,973, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Robot blade for wafers and workpieces and thin wafers and workpieces" was invented by Hsin-Kai Huang (Hsinchu, Taiwan), Kuei-Hsiung Cho (Hsinchu, Taiwan), Fu-Kuo Tseng (Hsinchu, Taiwan), Chun-Jen Chan (Hsinchu, Taiwan) and Chun Yan Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cross-shape transfer blade is configured to, in operation, be mounted or coupled to an end of a transfer robot arm (TRA). The cross-shape robot or transfer blade includes a plurality of raised regions to contact a backside of a workpiece or thin work...