US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "RFIC with substrate partition" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,564, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"RFIC with substrate partition" was invented by Wei Ling Chang (Hsinchu, Taiwan), Hsieh-Hung Hsieh (Hsinchu, Taiwan) and Tzu-Jin Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first substrate having a first substrate material, and the first substrate includes a first circuit. A second substrate has a second substrate material different than the first substrate material, and the second substrate includes a second circuit. A conductive interconnect electrically connects the first circuit and the s...