ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,075, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Method for mapping wafers in a wafer carrier" was invented by Lee-Chuan Tseng (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes generating a first beam of radiation toward a first slot of a workpiece carrier. The first beam of radiation has a first beam area that is greater than or equal to an area of an opening of the first slot. The method further includes measuring a reflected portion of the first beam of radiation that is reflected toward, and impinges on, a radiation sensor. The method further includes ...