US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,069, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" was invented by Chien-Wei Wu (New Taipei City, Taiwan), Hsien-Ju Tsou (Taipei, Taiwan), Yung-Chi Lin (New Taipei City, Taiwan) and Tsang-Jiuh Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding p...