US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Interposer via interconnect shapes with improved performance characteristics and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,191, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer via interconnect shapes with improved performance characteristics and methods of forming the same" was invented by Shang-Lun Tsai (Hsinchu City, Taiwan), Shuo-Mao Chen (New Taipei City, Taiwan), Monsen Liu (Hsinchu, Taiwan), Po-Ying Lai (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer may include a first metal trace located on a first dielectric layer, a second dielectric layer located on the first dielectric layer, a line-shaped via located in the second dielectri...