US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Bonding structures for stacked image sensor" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,888, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding structures for stacked image sensor" was invented by Hao-Lin Yang (Kaohsiung City, Taiwan), Kuan-Chieh Huang (Hsinchu City, Taiwan), Wei-Cheng Hsu (Kaohsiung City, Taiwan), Tzu-Jui Wang (Fengshan City, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan), Dun-Nian Yaung (Taipei City, Taiwan) and Yu-Chun Chen (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality...