US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,773, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure" was invented by Shao-Kuan Lee (Hsinchu, Taiwan), Cheng-Chin Lee (Hsinchu, Taiwan), Cherng-Shiaw Tsai (Hsinchu, Taiwan), Ting-Ya Lo (Hsinchu, Taiwan), Chi-Lin Teng (Hsinchu, Taiwan), Hsin-Yen Huang (Hsinchu, Taiwan), Hsiao-Kang Chang (Hsinchu, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a semiconductor structure, including: forming a conductive layer; forming a pat...