US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Semiconductor device including recessed interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,782, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device including recessed interconnect structure" was invented by Guo-Huei Wu (Tainan, Taiwan), Hui-Zhong Zhuang (Kaohsiung, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan), Shang-Wen Chang (Jhubei, Taiwan) and Yi-Hsun Chiu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends ...