US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Package structure containing chip structure with inclined sidewalls" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,852, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure containing chip structure with inclined sidewalls" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Che-Chia Yang (Taipei, Taiwan), Li-Ling Liao (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a chip structure having opposite surfaces with different widths. The chip structure has an inclined sidewall between the opposite ...