ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,500, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Semiconductor structure" was invented by Wei-Hao Liao (Taichung, Taiwan), Hsi-Wen Tien (Xinfeng Township, Hsinchu County, Taiwan), Chih-Wei Lu (Hsinchu, Taiwan), Yu-Teng Dai (New Taipei, Taiwan), Hsin-Chieh Yao (Hsinchu, Taiwan) and Chung-Ju Lee (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a gate structure, source/drain epitaxial structures, a contact structure, a first via structure, a metal line, a hard mask layer, a spacer layer, and a second via structure. The gate structur...