US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 20 for "Semiconductor package including SoIC die stacks" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,776, issued on Jan. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including SoIC die stacks" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes: an interposer; a System on Integrated Chips (SoIC) die stack bonded to a top surface of the interposer, the SoIC die stack comprising two or more dies bonded together; and a plurality of chips bonded to the top surface of the interposer. A first lateral distance, in a first direction, between a first boundary of the SoIC die stack and...