US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "Package structure with fan-out feature" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,771, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with fan-out feature" was invented by Meng-Liang Lin (Hsinchu, Taiwan), Po-Hao Tsai (Taoyuan, Taiwan), Po-Yao Chuang (Hsin-Chu, Taiwan), Yi-Wen Wu (New Taipei, Taiwan), Techi Wong (Zhubei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a redistribution structure, and the redistribution structure has multiple insulating layers and multiple conductive features. The package structure also includes a semiconductor die and a ...