US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "Method for conditioning polishing pad" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,154, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method for conditioning polishing pad" was invented by Shen-Nan Lee (Hsinchu County, Taiwan), Te-Chien Hou (Kaohsiung, Taiwan), Teng-Chun Tsai (Hsinchu, Taiwan), Chung-Wei Hsu (Hsinchu County, Taiwan) and Chen-Hao Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes measuring a first thickness at a first location of the polishing pad and a second thickness at a second location of the polishing pad; obtaining a first reference thickness at the first location of the polishing pad, wherein the first reference thickness...