US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 20 for "Isolation structure with multiple components to increase image sensor performance" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,560, issued on Jan. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Isolation structure with multiple components to increase image sensor performance" was invented by Wen-I Hsu (Tainan, Taiwan), Hsin-Hung Chen (Tainan, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Feng-Chi Hung (Chu-Bei, Taiwan) and Wen-Chang Kuo (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an image sensor including a plurality of photodetectors disposed within a substrate. The photodetectors are disposed respectively within a plurali...