ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,731, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Interconnect structure" was invented by Jung-Chou Tsai (Hsinchu, Taiwan), Fong-Yuan Chang (Hsinchu County, Taiwan), Po-Hsiang Huang (Tainan, Taiwan), Chin-Chou Liu (Hsinchu County, Taiwan) and Yi-Kan Cheng (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure includes a plurality of first pads, a plurality of second pads, and a plurality of conductive lines. The first pads are arranged to form a first column-and-row array, and the second pads are arranged to form a second column-and-row array. The first colum...